Thick copper PCBs are designed to handle high current and voltage applications. While standard copper thicknesses range from 18 to 35 µm, thick copper PCBs feature layers over 70 µm, and can go up to 204 µm. These boards, used for effective current and heat management, present production challenges including uniform etching and insulation. They require careful selection of prepregs and lamination conditions. 

However, increasing frequencies bring with them a number of challenges and limiting boundary conditions, such as inductive and capacitive effects, reflections and delay adjustments of the signals. This requires a high level of know-how, experience and process reliability in both PCB design and production. In order to avoid signal reflections at high frequencies, a defined characteristic impedance is often required. For this purpose, it is important to set and maintain the dialectic distance correctly.
The RF PCBs manufactured at APEX PCB transmit billions of pulses per second and exhibit effective impedance control through a controlled multilayer structure and precise conductor pattern.