- HDI circuit boards
HDI circuit boards - high-density wiring and smallest vias
HDI PCBs enable greater packing densities with finer line structures and high-density wiring. They use microvias, small connections between layers, which can be mechanically or laser drilled. Microvias can be placed directly in solder pads (via in pad technology) and can be staggered or stacked. This technology allows for optimal unbundling of BGA footprints and reduces the need for traditional vias. HDI boards also feature buried vias, which can be resin-filled or plugged, offering additional design flexibility.
Advantages
- Higher Wiring Density
- Reduced Space Requirements
- Finer Wire Structures
- Reduced Board Size
- Increased Component Space
- Optimal BGA Pitch Unbundling
- Enhanced Thermal Properties
- Improved Reliability
- Denser Conductor Routing
- Better Signal Integrity
Definition of HDI circuit boards
- Blind via: A contact from an outer layer connected to one or more inner layers.
- Buried Via: A via located in the inner layers, connecting at least two inner layers and not visible on the outer layers.
- Microvia: Blind via with a typical hole diameter ≤ 0.15mm and holes (usually drilled by laser) with an aspect ratio of just under
Technology spectrum
- Use of HDI microvias in multilayers (4-48 layers)
- 1+, 2+, 3+ configurations with staggered and stacked microvias
- Microvia hole diameter from 0.05 mm to 0.15 mm
- Copper-filled microvias for stacked structures in any-layers
Application examples:
- Control unit, automotive, satellite, microsystem, industrial technology
- Communication electronics
- Camera and video surveillance for “autonomous driving”
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